Used DISCO DFG 8540 #9212142 for sale

DISCO DFG 8540 is a heavy-duty, multi-functional wafer grinding, lapping and polishing equipment. The machine is designed to provide a cost-effective solution for grinding, lapping, and polishing wafers up to 8-inch size. DISCO DFG8540 offers a wide range of electrical and mechanical features to ensure excellent performance and uniformity in surface finishing. The system includes powerful in-line multiple spindles for simultaneous surface finish operations at multiple positions on a single wafer. The cutter spindles are capable of adjusting the pressure and speed to obtain desired condition. The machine is also equipped with servo-controlled dresser for accurate cutting. An integrated dust collector reduces airborne particles and lengthens the life of cutting tools by removing debris from the workspace. DFG 8540 is equipped with a dressing unit for diamond and lapping plates, with a preset pressure and speed to provide consistent surface finish. It is also able to perform surface conditioning of wafers by removal of surface layers as well as profilometry. The machine is designed with an accuracy maintaining mechanism that ensures constant grinding depth and improved surface quality. The machine is designed to match customer requirements and can be customized according to their needs. The machine can be equipped with a full range of accessories including polishing cloths, pads and supplies, customized cleaning machinery, and peripheral equipment. The tool has an integrated data storage and management asset that records staff hours, cost of materials, and progress of the grinding, lapping and polishing jobs. DFG8540 is a user-friendly grinding, lapping and polishing machine that is ideal for use in large-scale industrial applications. Its powerful features and ability to produce consistent results make it a reliable and cost-effective solution for wafer grinding, lapping, and polishing.