Used DISCO DFG 8540 #9212146 for sale

DISCO DFG 8540 is a wafer grinding, lapping and polishing equipment that combines the high-precision dual-side grinding, high-precision lapping and ultra-smooth polishing technologies of DISCO. DISCO DFG8540 is suitable for the efficient grinding, lapping and polishing of various types of semiconductor wafers and materials. The system is equipped with an oscillating motion grinder that utilizes a simple construction mechanism and offers a wide grinding area with precision control, enabling high throughput applications. The grinder is equipped with an advanced grinding flow control unit, that enables it to achieve a high degree of grinding efficiency. Its counter-controlled motor ensures that no heat is generated during grinding. The grinder is also equipped with an air-jet device that helps reduce the number of particles generated during grinding, making it suitable for cleanroom operations. The lapping and polishing process of DFG 8540 is powered by an integrated fully-automatic lapping/polishing machine and an automatic loading/unloading machine. The lapping and polishing process utilizes a revolutionary three-stage process that ensures a smooth, uniform surface. The improved surface roughness allows the wafers to be optimized for a wider range of applications. The lapping table of DFG8540 is equipped with an air-bearing detection device that can detect any wafer defects. This feature helps ensure that the lapping process produces uniform and high quality products. The tool also offers a user-friendly interface that assists users in setting up and controlling the lapping and polishing process. DISCO DFG 8540 also offers a variety of optional accessories to customize the asset for specific applications. The model offers a wide range of consumables, such as diamond grinding discs, lapping plates, and consumables. Users can also use a variety of accessories such as a motorized wafer tacker and an automated wafer tusk lifter. DISCO DFG8540 is an ideal solution for efficient wafer grinding, lapping and polishing. With its advanced grinding flow control equipment and integrated automatic lapping/polishing machine, users can achieve a high level of accuracy and efficiency required in today's wafer processing industry.