Used DISCO DFG 8540 #9212147 for sale

DISCO DFG 8540 is a highly advanced wafer grinding, lapping, and polishing equipment that is used to create smooth surfaces with precise shapes and size on semiconductor wafers. This allows electrical components to be built on top of the wafer with extreme accuracy and reliability. The 8540 system is designed to perform a variety of automated processes to create flat and smooth surfaces. It has a wide range of grinding tools, such as diamond abrasive plates for precision wafer finishing, plus a variety of lapping polishing & slurry tools. This provides users with the ability to perform various surface polishing operations for wafer sizes up to 8 inches in diameter. The unit is designed with a high torque spindle and a rigid frame structure. This ensures the ability to produce superior surface quality and reduce the likelihood of fractures during the grinding, lapping, and polishing process. The machine is fully enclosed and runs quietly with low emissions, making it a safe and comfortable environment for any operators of the tool. To ensure a quality finish and effective operation, the asset is also equipped with a two-axis computer-aided sliding table. This gives users the ability to accurately and quickly adjust the grinding, lapping, and polishing parameters. It also has the flexibility to adjust to different profiles and sizes of wafers. DISCO DFG8540 has proven effective in the production of high-quality wafers and components for various industries, including the semiconductor industry, optical components, mechanical components, and precision optics. With its advanced grinding, polishing, and lapping capabilities, the 8540 model allows users to produce a broad range of high-quality products with a high level of repeatability and accuracy.