Used DISCO DFG 8540 #9225618 for sale
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ID: 9225618
Vintage: 2017
Fully automatic in-feed surface grinder
Spindle maximum revolution: 7000/min
Air: 0.5~0.8 MPa
Cutting water: 0.3~0.4 MPa
Cooling water: 0.3~0.4 MPa
Universal chuck, 8"
Includes:
DISCO DTU152 Chiller
Wheel coolant: 0.3 MPA 25 L/min
RCW: 0.2 MPa 7 L/min
DISCO LEM40SSU-010-A Vacuum unit
Water: 0.05 MPa, 1 to 3 L/min
Media handler type: Wafer
Power: 200 V, 50/60 Hz, 3 Phase, 54 Amps
CE Marked
2017 vintage.
DISCO DGF 8540 is a high precision, multi-function wafer grinding, lapping and polishing equipment, specifically designed for the semiconductor industry. The system is capable of processing a variety of wafer dimensions, ranging from 3" up to 300mm, and is equipped with an array of user-friendly and advanced features to provide optimal process repeatability. DISCO DGF 8540 is comprised of several core components, including the main frame, CCD camera, and user-interface PC. The main frame of the unit is composed of a cast iron base, motorized stages, and vibration-minimizing table. The industrial-grade X and Y stages provide high-precision positioning and a repeatable path accuracy of 0.1μm. The powerful 1.5kW spindle motor is outfitted with a pneumatic spindle drive for variable-speed grinding, lapping, or polishing. The machine is fitted with a liquid-cooled spindle that is capable of operating up to 80,000 RPM for efficient wafer machining operations. The integrated CCD camera allows for noncontact inspection of the machined wafer on the LCD monitor, and allows for the process parameters to be adjusted in real-time without halting production. The PC-based user-interface provides a friendly, intuitive graphical display that helps guide users through the entire process. The tool is capable of storing multiple recipes and editing them, along with processing environment monitoring and logging. DISCO DGF 8540 is capable of both dry and wet grinding processes, and is specifically designed to reduce particle generation, while providing a more cost-effective alternative to manual processing. The asset provides consistent and repeatable results, with a minimum particle size of 11nm. The wafer grinding model is available in both single and dual-head configurations, and is equipped with a robotic wafer loading equipment for added convenience. DISCO DGF 8540 is an ideal choice for high-volume wafer grinding, lapping, and polishing applications. Its advanced features, high precision, and repeatability make it an invaluable addition to any semiconductor processing facility.
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