Used DISCO DFG 8540 #9230171 for sale

DISCO DFG 8540 is a unique and highly reliable wafer grinding, lapping and polishing equipment. Specifically designed for use in the semiconductor industry, this system packs a powerful punch and offers a host of features and benefits. DISCO DFG8540 is built for optimal productivity, with a high process speed and repeatability. With a wafer size range of 85mm to 400mm and a thickness range of 2mm to 35mm, it has the capacity to process a wide range of wafer sizes and types. Its automated functions such as exchanging and cleaning are capable of optimizing processing times and ensuring consistent results. The unit utilizes advanced motion control technology to ensure consistent and precise motion quality during lapping, grinding and polishing of wafers. Its high-performance lapping and polishing plates feature even surface hardness distribution and are designed to achieve consistent, high-quality wafer surface finishes. In addition, the machine is equipped with a number of other advanced features, such as an automatic grindstone changing mechanism and a tilt in/out mechanism to adjust the grinding depth. For safety, the tool incorporates protective measures to ensure all components are at safe and reasonable temperatures. The asset also has built-in sensors to detect vibration and foreign material in the processing chamber, as well as an automatic water stop device to prevent machines from malfunctioning or overstressing. The user-friendly design of DFG 8540 also makes it simple to use and maintain. All of the necessary operations are conveniently located on the front panel, making it easy to monitor and control. The model also features a large LCD monitor with an operational menu, making it easy to navigate. Overall, DFG8540 is an advanced wafer grinding, lapping, and polishing equipment for the semiconductor industry. It offers a host of features and benefits designed to optimize productivity, ensure consistent results, and keep operators safe. From automated functions to a user friendly design, the system packs a powerful punch and offers a reliable and effective solution for a wide range of wafer processing tasks.