Used DISCO DFG 8540 #9230301 for sale

DISCO DFG 8540 wafer grinding, lapping and polishing equipment is a state-of-the-art setup used to grind, lap and polish semiconductor and optical wafers. The system is composed of two CNC grinding machines for flat grinding and corner grinding, a single-sided polishing machine, a double-sided polishing machine and an air lapping and polishing machine. The CNC is fully automatized with the use of ballscrews, servomotors and linear scales, ensuring accuracy with each pass. The X and Y axes can move up to 360 degrees with a resolution of 0.001mm and a maximum feed speed of 20m/min. Also, the unit can grind in a very small area where the depth of cut can be controlled with precision. The polishing machine comes with an in-built arm assembly that provides uniform pressure on the wafer as it is moved across the pad. The double-sided polishing machine includes two independent robotic arms, a top and a bottom, which can hold multiple wafers at the same time. Each arm is fitted with contact control systems for ensuring uniform pressure is applied on each wafer and eliminates the need for manual calibration. The air lapping and polishing machine is composed of two arms which are driven by two independent motors and each has two plates for holding the wafers. It utilizes an ultrasonic process that produces a uniform, repeated pattern, ensuring an even polishing surface. The theoretical accuracies of this machine range from +/- 0.1 to 0.005 mm, while the rotation speed can be adjusted from 900 to 6000rpm. DISCO DFG8540 is a powerful machine designed to produce the highest quality wafer surfaces. It is equipped with the latest technologies in grinding, lapping and polishing, producing continually consistent process results that have been verified on multiple levels. The tool has also been designed with user-friendly operation in mind, providing a number of easy-to-read displays and a wide range of process settings to ensure maximum efficiency with each pass.