Used DISCO DFG 8540 #9239485 for sale

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ID: 9239485
Wafer Size: 4"-8"
Vintage: 2004
Wafer grinder, 4"-8" Grinding method: In-feed grinding with wafer rotation Spindle: Type: Air bearing with high frequency motor 2 Axes Output: 4.2 kW Revolution speed: 1000-7000 RPM Z-Axis vertical stroke: 120 mm (With zero point) Z-Axis vertical grinding feed speed: 0.0001-0.08 mm/s Z-Axis vertical fast feed speed: 50 mm/s Minimum Z-Axis vertical movement: 0.1 µm Minimum Z-Axis vertical movement resolution: 0.1 µm Height gauge: Measurement range: 0-1800 µm Resolution: 0.1 µm Repeatability: ±0.5 µm Wafer chuck table: Type: Porous chuck table Chuck method: Vacuum Number of revolutions: 0 - 300 min^-1 (3) Chuck tables Chuck table cleaning Spark out (Chuck table revolutions setting): 0-999 Grinding wheel: Diamond wheel: ø200 mm Wafer handling section / Wafer cleaning section: (2) Cassette storages Cassette flow: Same and open Spinner unit: Water washing and drying Vacuum unit: Discharge speed (m3/h): 29/36 (50/60Hz) Achievable pressure (kPa•G): -90 Water supply temperature 15°C Water supply flow rate: 1 L/min Electric motor: 1.5 kW Water flow rate (L/min): When supplied water temperature > 22°C: 3 When supplied water temperature < 22°C: 1 Grinding accuracy: Thickness variation within one wafer: < 1.5 µm Thickness variation between wafers: < ±3 µm Finish surface roughness: Ry 0.13 µm (with 2000 finish) Ry 0.15 µm (with 1400 finish) Utilities: Air pressure (MPa•G): 0.5 - 0.8 Air flow rate (L/min): 400 ANR Water pressure: 0.3 - 0.4 0.2 - 0.3 0.052 - 0.49 Water flow rate: 25 and 4 Exhaust duct capacity (m3/min): 4 Power supply: 200 VAC ±10%, 3-Phase (50/60Hz) Power consumption: 5.8, 3.3 Maximum power: 19 kVA 2004 vintage.
DISCO DFG 8540 wafer grinding, lapping, and polishing equipment is a state-of-the-art system designed to efficiently and accurately process a variety of substrates. This unit features an all-in-one design that performs grinding, lapping, and polishing processes in one pass. DISCO DFG8540 is ideal for a wide range of applications, including nano-processing, thin-film deposition, and CMP applications. DFG 8540 is equipped with an advanced grinding and polishing spindle that is capable of generating forces up to 25 kN, allowing for extremely accurate material removal. The machine features a large grinding area and auto-indexing function, making it well equipped to handle large scale production. The tool can be used with a variety of consumables, including diamond grinding and polishing caps, and custom configured grindstones. The configurable feed speed can be optimized for the application, allowing for precise and controlled material removal. The adjustable gap control mechanism ensures uniform contact of the consumables on the substrate, while the fine-grained control of the pressure plate ensures consistent results. DFG8540 is designed with automatic wetting and in situ cleaning of the grinding area, which helps prevent breakage, scratches, and other damaging effects. The built-in cooling asset eliminates heat buildup, ensuring consistent results across each entire process. Furthermore, the machine is equipped with an automatic contamination monitoring model to constantly measure the environment and ensure accurate and error-free parts production. The advanced control equipment, coupled with the user-friendly touch panel interface, makes DISCO DFG 8540 friendly and simple to use. The system features intuitive self-diagnostic functions, as well as modifiable grinding/polishing conditions for multiple substrates. In addition, real-time display of the processing process allows for easy adjustment and optimization of the process. DISCO DFG8540 is a powerful, high-precision unit designed to efficiently and accurately process a variety of substrates with accuracy and precision. This machine is ideal for a wide range of applications, including nano-processing, thin-film deposition, and CMP applications. With its robust, high-precision features and intuitive user interface, DFG 8540 is the perfect choice for demanding industrial environments.
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