Used DISCO DFG 8540 #9249937 for sale

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ID: 9249937
Vintage: 2007
Grinders 2007 vintage.
DISCO DFG 8540 is a Planarizer equipment designed for Wafer Grinding, Lapping, and Polishing. It is capable of highly precise, efficient grinding and polishing of a wide range of materials, including semiconductor wafers, ceramic materials, and optical components. The system includes a high-precision grinding/polishing mechanism, a powerful vacuum unit, and a precision-control platform. The grinding/polishing mechanism of DISCO DFG8540 incorporates a diamond-coat grindstone and two lapping plates constructed from soft metals. The diamond-coat grindstone is capable of grinding and polishing wafers to a very low roughness level (Ra = 0.75nm or less), while the metal lapping plates are used for precise mirror-like polishing. The vacuum machine is used to remove particles generated during the grinding and polishing process and also to help maintain a static, clean, and dust-free environment. Finally, the precision-control platform provides precise control in the grinding/polishing process, allowing for consistency and repeatability throughout the entire cycle. DFG 8540 is designed for both high performance and reliability in the most difficult applications. It has a reputation for providing superb surfaces and very precise and consistent results. Its high production rate, high efficiency, and flexible configuration make it suitable for a variety of wafer grinding, lapping, and polishing tasks. It is also capable of accommodating a wide range of wafer sizes and shapes, making it ideal for use in multiple application areas. DFG8540 is extremely easy to operate. All of the settings and controls can be adjusted according to the user's needs, making it suitable for a wide range of users, even those with minimal experience in wafer grinding, lapping, and polishing. The tool is also very reliable and can run continuously 24 hours a day, 7 days a week. In summary, DISCO DFG 8540 is a reliable and efficient asset designed for wafer grinding, lapping, and polishing. Its high-precision grinding/polishing mechanism and powerful vacuum model ensure clean and precise operations. Its precise control platform and flexible configuration also make it well-suited for a wide range of applications in the semiconductor, ceramic, and optical industries.
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