Used DISCO DFG 8560 #293633046 for sale

DISCO DFG 8560 is a highly versatile wafer grinding, lapping and polishing equipment. This state-of-the-art system offers consistent and repeatable processing for high-volume production needs. With features like automated grinding, lapping, and polishing, DISCO DFG8560 provides a high-throughput and cost effective solution that easily adapts to many different applications. The unit is designed to be integrated with the user's existing production line, offering efficient and fast processing when combined with the user's existing machines. Starting with the grinding and lapping stages, DFG 8560 is designed to quickly and repeatably create the desired surface conditions, with a single device that offers both negative pressure grinding and positive pressure lapping. The negative pressure grinding method allows the machine to eliminate burrs and other imperfections, while the positive pressure lapping step further refines the surface texture and smoothness. The grinding and lapping occurs at a high-speed, 5,000 to 10,000 rotation per minute, giving accurate and even results. DFG8560 also includes an integrated water rinse tool that can be used to cool the tooling prior to lapping and reduce the chances of overheating. Next is the polishing stage. DISCO DFG 8560 utilizes a ceramic plated grinding/polishing carrier head, providing a smooth and consistent finish. Additionally, the asset offers a variety of diamond discs, wheels and pads to meet the specific requirements and textures required for the individual application. The integrated force feeders automatically adjust the pressure applied to the polishing pad or disc as it is being used, so that the desired surface finish can be achieved. Finally, DISCO DFG8560 includes a CCD imaging and video inspection model. This provides real-time feedback of processing results and the ability to quickly adjust settings for the next portion of wafers. This automated feedback helps to ensure the highest quality batch is processed, minimizing the amount of rework and ensuring yields stay consistent. DFG 8560 is a powerful and precise wafer grinding, lapping, and polishing equipment. From burr removal to surface texture and polishing, it offers a comprehensive solution to process a wide variety of wafers, in both high and low volume production. Each step of the process is precisely controlled with the integrated CCD imaging and automatically adjusting force feeders, so that the end result meets the required parameters time after time. With customizable components, the system can be tailored to the exact needs of your application, helping to increase product yields and reduce the need for rework.