Used DISCO DFG 8560 #293641050 for sale

DISCO DFG 8560 is a wafer grinding, lapping and polishing equipment that provides a total solution for substrate condition preparation. Its main advantages are its high accuracy, long service life, and low cost of ownership. This system allows for multi-axis/multi-surface machining and is suitable for a wide range of substrates. DISCO DFG8560 has four grinding/polishing discs and two lapping/polishing discs and can be attached to two arms for a press loading unit. It is highly automated, with a computer-controlled variable speed motor and the ability to monitor and adjust the speed during the grinding and polishing processes. The grinding and polishing discs are configured to allow for optimal surface preparation and the precision machining of substrates. The machine has adjustable temperature, speed, pressure, and thickness controls, allowing for close monitoring and high accuracy. The power of DFG 8560 is also impressive, with as much as 200kW of grinding/polishing/lapping power and up to 400 kW of power for lapping/polishing. The tool also has a rotary table that allows for precise and precise angle control. This ensures the accuracy of the substrate and its precise alignment with the grinding and polishing discs. As well, the asset offers the flexibility to process substrates of various sizes, shapes, and thicknesses. The model offers both manual and semi-automatic operation and can be equipped with a wide range of accessories, such as additional grinding/polishing stones, blades, and burrs. The DFG 8560also features a built-in exhaust equipment that reduces noise and helps to keep the environment clean. Additionally, an advanced vibration detection and control system optimizes the performance of the machine and prevents damage due to excessive vibrations and thermal expansion. Overall, DFG8560 is a highly capable and precise wafer grinding, lapping, and polishing unit that helps optimize substrate preparation processes. It offers a high degree of accuracy, long-term reliability and service life, and a low cost of ownership. It is well suited for the preparation of a wide range of substrates in the semiconductor and other industries.