Used DISCO DFG 8560 #293641103 for sale

DISCO DFG 8560 is a precision wafer grinding, lapping and polishing equipment designed for the production of high-quality wafers, such as those used in fiber-optic communications, semiconductor lasers and displays, in a variety of concave and convex shapes. The system provides the speed and precision necessary for today's electronics industry. DISCO DFG8560 is capable of grinding, lapping, and polishing wafers of many different types and sizes. With a range of grinding and polishing speeds, it can be used to achieve a fast and precise finish. The unit has been engineered to be easy to operate and maintain, while also providing superior control to get the most out of the production of wafers. DFG 8560 features a rigidly constructed frame, a low vibration drive, and a powerful motor to ensure that even the thinnest wafers are ground, lapped and polished with high levels of accuracy. It also comes with a range of process controls, including automated grinding and polishing speed control, a sophisticated feedback machine to monitor the pressure, velocity and angular position, and a variety of grinding, cutting and polishing tools. The tool is also capable of performing a full range of operations such as slicing, dicing and chamfering. The asset provides a high level of safety to keep operators safe while they are running the model. An efficient dust collection equipment equipped with air filters helps to reduce the particles and airborne contaminants that can damage the wafers being processed. Additionally, a capillary control system prevents the grinding plate from becoming contaminated by oil. DFG8560 is a reliable and efficient piece of equipment that can help improve the production and quality of wafers for use in the manufacturing industry. It offers excellent control and precision capabilities to produce wafers with the highest level of accuracy and quality.