Used DISCO DFG 8560 #293668040 for sale

DISCO DFG 8560 is a state-of-the-art wafer grinding, lapping and polishing equipment that is designed to meet the demand of even the most advanced semiconductor processing applications. Thisgrinding, lapping and polishing machine is designed for processing various materials such as monocrystalline and polycrystalline silicon wafers, copper and carbonfilm in sizes up to 200mm (8") in diameter. The main features of DISCO DFG8560 include a highly rigid mechanical construction that is ideal formaintaining accuracy over a long period of time, an optimized user interface with graphical guidance for quick and accurate operation, a six-axis motion system for precise grinding, lapping and polishing motions, and an advanced vision unit for accurate vision inspection. DFG 8560 is equipped with two distinct grinding/lapping elements, allowing for simultaneous grinding and lapping at both the top and bottom of the wafer. The top side is equipped with a closed loop grinding element, where a coated abrasive disk or brush is used to remove material from the surface of the wafer. The bottom side is equipped with an open loop lapping element, where a special lapping film is used to either polish or lap the wafer. Additionally, DFG8560 machine is equipped with a post-lapping cleaning station, which can be used to remove any debris left behind after the grinding/lapping process. In addition to providing a highly accurate grinding, lapping and polishing tool, DISCO DFG 8560 also provides various advanced features. This includes an advanced vision asset with both standard and dedicated vision cameras that can be used to inspect the wafer's surface for defects. This allows for a more accurate and repeatable process and reduction of potential defects. DISCO DFG8560 is also equipped with an integrated motion control model, which makes it easier to track and control the machine's movements for an even more flexible and versatile equipment. DFG 8560 is an incredibly versatile and reliable wafer grinding, lapping and polishing system. Its combination of advanced features and rigid mechanical design makes it an ideal choice for the most demanding semiconductor applications. With its proven reliability and effectiveness, it is one of the most popular wafer grinding, lapping, and polishing solutions available today.