Used DISCO DFG 8560 #293758355 for sale

DISCO DFG 8560 is a highly advanced wafer grinding, lapping and polishing equipment. It is designed for precision, high density, and long-term, repeatable substrates. This system is suitable for medical device precision applications and is suitable for grinding up to six-inch wafers. It can also be adapted for flat, angled and curved wafers as well as sintered wafers. The unit comprises of a large platform with one or two linear slide controllers, a motor-driven spindle, a bonding fixture, a grinding wheel and its associated sensors. The linear slide controllers move the bonding fixture and grinding wheel for precise positioning on the wafer. The motor-driven spindle is driven by a servo motor and is adjustable, offering excellent repeatability. The grinding wheel is equipped with high-precision sensors to provide feedback for process monitoring and control. DISCO grinding is capable of producing a perfect finish by drawing materials off the surface of the wafer in a consistent manner, producing an even end-mold. The grinding wheel is equipped with cutting-edge technologies such as Diamond Lapping and Modulated Grinding, to ensure a precise and high-quality finish. These advanced grinding techniques prevent deformation of the wafer and assure the highest possible yields. The lapping function of DISCO DFG8560 is accomplished through the use of a patented diamond lapping technique. Diamond laps can be used with a variety of samples, from glass to silicon, and provide excellent surface flatness and accuracy, with minimal material loss. In addition, DISCO incorporates ultra-precision polishing capabilities, allowing for an even finish with a high surface area in a fraction of the time required with conventional polishing systems. DFG 8560 is also equipped with a variety of advanced software features, making it easy to program and monitor the entire process cycle. This includes automatic loading and unloading of wafers, an intuitive graphical user interface (GUI) for programming and monitoring, an automated inspection machine, and software integration with other DISCO systems. Overall, DFG8560 is a highly advanced, reliable, and precise tool for grinding, lapping and polishing wafers. It is designed to provide superior finish quality and yield, and can be integrated into a wide variety of production processes. It is also equipped with a range of advanced software features to ease programming and ensure optimal output.