Used DISCO DFG 8560 #293761079 for sale

DISCO DFG 8560 is a wafer grinding, lapping and polishing equipment designed for superior wafer flatness and surface finish. The system offers an innovative combination of unmatched grinding, lapping and polishing technology on a single platform, allowing users to benefit from unprecedented levels of both cost effectiveness and precision. The unit is ideally suited for production of both double-side and single-side polished wafers up to 8-inch in diameter. It includes a high-precision linear motor driven stone grinding stage and a click-stop, programmable turntable polishing stage capable of delivering exceptionally flat wafer results. The high-speed, high-precision grinding stage is capable of grinding both Silicon and Sapphire wafers with minimal part-to-part variation. The patented high-pressure lapping technology used in the machine ensures a flatness of just 10 microns PV, produced with extremely uniform surface qualities across the entire wafer surface. DISCO DFG8560 also features full-arc hydro-abrasive polishing for superior surface finishes. The tool uses diamond-slurry polishing technology which produces superior feature sharpness and uniformity in both single-side and double-side polishing. The asset continues to offer excellent flexibility with its large programmable turntable. It is designed to accept a variety of process recipes, allowing users to optimize wafer processing according to their specific applications. The model also offers integrated online process control, which allows process parameters to be monitored and adjusted easily in real time. Overall, DFG 8560 is an excellent choice for anyone who needs a cost-effective, high-precision wafer grinding, lapping or polishing systems. The equipment offers superb wafer polishing performance on both single-side and double-side polished wafers, and its intuitive, user-friendly interface makes it easy to optimize processes according to individual requirements.