Used DISCO DFG 8560 #293765587 for sale

DISCO DFG 8560 is a wafer grinding, lapping and polishing equipment used primarily in the semiconductor industry. It uses abrasive media and polishing films to grind, lap and polish wafers down to a final finish. The system offers the capability to grind up to fourteen inch wafers. The unit is designed for a 24/7 production environment and is robust enough to handle challenging processing needs. DISCO DFG8560 is equipped with a three axis support platform that allow for versatility in multistep operations. For example, the platform supports simultaneous lapping and polishing operations. Additionally, the unit is equipped with a fully automated grinding process control including support for optical roughness measurements. This ensures consistency and repeatability for desired results. To facilitate loading and unloading, the unit features a shuttle arm unit that can handle up to twenty-nine wafer cassettes. DFG 8560 wafer grinder is suitable for grinding processes involving abrasive media ranging from 16.0 to 0.3 microns. It is also capable of performing pitch polishing and surface roughness correction. This includes the grinding and polishing of straight line grooves, stepped surfaces, burrs, and multi-angled edges. The machine features a durable grinding head with low noise and vibration for precision processes. The grinding head is driven by a direct current motor and can be configured with a range of abrasive media and polishing discs for a variety of processes. Additionally, DFG8560 offers a secure environment with high temperature stability and air filtration tool to protect the wafers at any time. The built-in e-Stress functions constantly monitor and adjust conditions like temperature, pressure and air quality to protect the wafers during the grinding process. In summary, DISCO DFG 8560 is a versatile wafer grinding asset that is designed to enable reliable and repeatable polishing operations for a wide range of wafers. It is equipped with a range of automated functions to ensure precise grinding and polished results, and is capable of supporting a wide range of abrasive media and polishing disks. The unit is specifically designed to deliver fast and reliable grinding processes within a secure environment. As such, it is an important tool for a wide range of semiconductor manufacturing operations.