Used DISCO DFG 8560 #293827155 for sale

DISCO DFG 8560 wafer grinding, lapping and polishing equipment is a reliable and versatile tool for grinding, lapping and polishing of semiconductor wafers and ICs. DISCO DFG8560 features an integrated programmable controller with recessed safety panel and a color LCD 800x480 touch-screen display. The system provides a user-friendly interface that allows for setup of grinding, lapping, and polishing parameters, as well as allowing for in-situ monitoring of wafer and IC production quality. The unit's integrated multi-process controller enables smooth communication between the machine and process parameters, providing consistent, repeatable results. The integrated graph report generation feature allows for easy analysis and comparison of various process parameters. The machine also features removable microwave and hydrocyclone separators to maintain clean cooling solutions during operation. The tool is capable of performing ultra-fine polishing down to 2.5 um Rms. DFG 8560 includes an advanced dust collection asset, ensuring efficient removal of dust and particles that are created during lapping and polishing processes. The dust collection model is equipped with adjustable vacuum power and vacuum pressure control. The integrated filtration equipment eliminates dust makeup by collecting particles and prevents spark generation. The system is capable of grinding and polishing up to 6" wafers, while maintaining uniform results without warping. It also features an automated turret to precisely move the wafers in and out of the process. DFG8560 allows for maximum pressure control when working with delicate products and features a variety of polishing media. The unit is capable of selecting the best suited material to meet the customer's production requirements. Overall, DISCO DFG 8560 wafer grinding, lapping and polishing machine is an advanced and reliable tool for semiconductor wafer and IC production, providing superior quality results and repeatable, controlled performance.