Used DISCO DFG 8560 #293827490 for sale

DISCO DFG 8560 is a wafer grinding, lapping and polishing equipment designed to process both planar and 3D semiconductor wafers up to 8-inch in diameter. The system is compact and flexible, allowing processing of both single- and double-sided wafers. It is designed specifically for processing both silicon and High-K dielectric materials. DISCO DFG8560 utilizes a combination grinding, polishing, and lapping stages to achieve a precise nanometer-scale surface finish. It is equipped with DISCO Versatile-Polishing-Unit (VPU) which utilizes two separate rotating and orbiting, high-precision, fine pitch disks for very precise flatness and surface finish control. Additionally, the unit is fitted with a high-performance cleaning machine which utilizes both air and chemical solutions to ensure that all contaminants are effectively removed. The tool includes the dedicated conditioning unit, which is used for grinding and lapping. It is designed with a combination of diamond grinding and SiC lapping plates to effectively process both planar and 3D substrates. The asset also features an advanced cooling model to ensure efficient heat removal from the processing process. The user-friendly touch screen interface allows for the easy setting of the wafer process recipes and parameters. The user can select from a range of grinding, lapping, and polishing steps and modify the parameters of each, such as speed, pressure, velocities, and pitch. This allows for maximum flexibility and control over the substrate surface finish. DFG 8560 is equipped with comprehensive safety features to ensure the safety of operator and sensitive substrates in the processing chamber. It has both an emergency stop button and a door interlock equipment to prevent operator injury. It also has environment sensors that monitor the process environment to ensure the highest level of safety. DFG8560 is a reliable, efficient, and reproducible wafer grinding, lapping and polishing system. It is equipped with both manual and automatic operation modes, and comprehensive built-in safety features to ensure the safety of the unit and its operator. It is designed to deliver precise nanometer-scale surface finishes to both planar and 3D substrates for a variety of semiconductor processing applications.