Used DISCO DFG 8560 #293827491 for sale

DISCO DFG 8560 is a wafer grinding, lapping and polishing equipment used to achieve excellent surface roughness, flatness and parallelism on wafer surfaces. Its advanced automation and control capabilities enable rapid, low-cost processing of wafer surfaces while ensuring that the specified levels of quality are maintained. The machine consists of grinding plates, lapping plates, a polishing stand and an automated component cassette containing various components such as polishing pads and discs. The grinding plates are comprised of a rotary table, grinding heads and a control unit. The rotary table is used to support and rotate the wafer to be processed in a consistent manner. The grinding heads mounted on the table enable the rough grinding of the wafer surface. Its system of freely adjustable parameters enables accurate processing of the wafer. The lapping plates on the machine are designed to enable fine grinding. They consist of a table, lapping heads and a control unit. The lapping heads on the table move in two directions, allowing the wafer surface to be ground in accordance with the programmed parameters. The lapping plates precisely grind the wafer surface to a specified thickness. The polishing stand on the machine is used to achieve good surface flatness and parallelism on wafer surfaces. The unit consists of a rotary table with numerous adjustable parameters and a motor unit to drive the table. The motor is capable of rotating the table at various speeds to ensure suitable processing conditions for optimal polishing. The component cassette component is also included in DISCO DFG8560. This automated machine stores and provides the various components required for polishing and lapping. This includes polishing pads, diamond discs and buffing pads for the polishing of wafer surfaces. DFG 8560 is an essential tool for achieving excellent surface quality on wafer surfaces. Its easy-to-use programmable parameters and automated component cassette are key features that enable rapid, low-cost and accurate processing of wafer surfaces.