Used DISCO DFG 8560 #9173636 for sale

DISCO DFG 8560 is an automated wafer grinding, lapping and polishing equipment. The system is designed to automatically process semiconductor wafers up to 8 in. in diameter. The unit provides high throughput and accuracy with its four-level diamond milling process and two-head polishing machine, resulting in high quality finished wafers. The tool consists of four stages: grinding, lapping, polishing, and inspection. The grinding mechanism of DISCO DFG8560 consists of a pair of two high-precision linear slides parallel to each milling wheel and a pair of two servo motors. The linear slides move the wafe to the desired position for milling. The servo motors drive the milling wheel to the correct position for wafer grinding. The linear slides have a resolution of 0.5 um and a repeatability accuracy of 1 um. In DFG 8560 lapping stage, the diamond grinding wheel sweeps across the wafer surface to refine the surface smoothness. The lapping step uses a diamond lapping wheel to abrade the surface of the wafer to obtain an even and flat surface. The lapping wheel is made up of diamond grains that are designed to be highly abrasive and is capable of removing a thin layer of the wafer surface with each pass. The polishing stage of DFG8560 uses a two-head polishing wheel to further smoothen the surface. The two-head wheel has two abrasive media surfaces which buff and shape the wafer's surface at the same time. The two-head polishing wheel is also capable of removing micro-scratches on the wafer. The Inspect stage is used to check the surface quality and polish grade of the wafer. The Inspect station is equipped with an optical microscope to magnify and analyze the surface condition of the wafer at various points. The results from the Inspect station are used to fine-tune the asset operation and ensure consistent high-quality polishing results. Overall, DISCO DFG 8560 wafer grinding, lapping and polishing model is capable of producing high-quality finished wafers. Its combination of precision linear slides, servo motors and two-head polishing wheel provides for accurate and repeatable results. The Inspect station round off a comprehensive solution for automated production of high-quality semiconductor wafers.