Used DISCO DFG 8560 #9215228 for sale

DISCO DFG 8560
ID: 9215228
Back grinder.
DISCO DFG 8560 equipment is an advanced state-of-the-art wafer grinding, lapping, and polishing machine. This single-side polishing system is designed to achieve a high-quality surface finish on semiconductor wafers, such as gallium arsenide (GaAs), indium phosphide (InP), and quartz. The unit is equipped with a precision linear motor drive that enables high-precision grinding and polishing without a manual operation. DISCO DFG8560 is an easy-to-setup and operate machine that can process wafers of up to 150mm in diameter. The machine is based on a three-axis linear motor drive tool, which provides automatic loading, wafer transport, and unloading as well as high speed and accuracy for precision grinding and polishing processes. The asset can be equipped with up to four heads and two wafer chucks, allowing for simultaneous grinding and lapping. The chuck is made of stainless steel and is heated by water jets to prevent damage from thermal expansion. The polishing wheel is available in both one-rinse and multi-rinse designs, providing flexibility depending on the wafer's surface. The polishing speed can be precisely adjusted to control the polishing aggressiveness to match the type of wafer being processed. The model is powered by a robust and reliable DC servo motor with a dedicated control unit. This powerful motor allows for higher torque and faster grinding speed compared with traditional motors. The equipment is also equipped with advanced temperature and pressure sensors that monitor the machine's performance and provide real-time data. This ensures consistent and reliable results each time. DFG 8560 is an easy-to-maintain system that includes a self-diagnostic unit to alert users of any maintenance issues. The machine is also designed for minimal power and noise emissions, making it suitable for any laboratory or production environment. With all of its features, DFG8560 is a powerful and reliable machine for high-precision grinding, lapping, and polishing of semiconductor wafers.
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