Used DISCO DFG 8560 #9215251 for sale

DISCO DFG 8560 is a wafer grinding, lapping & polishing equipment capable of handling a wide variety of applications. This versatile system is built to serve the needs of the semiconductor, MEMS, nanotechnology and related microelectronics industries, as well as research and development organizations. As a combined wafer grinding, lapping & polishing unit, DISCO DFG8560 is highly configurable, offering users the ability to tailor the machine to their exact needs. DFG 8560's advanced core technology and user-friendly tool design allow for efficient processing of various wafer types, ranging from brittle and hard materials to thin and sensitive wafers. In addition, the asset is capable of processing a wide array of complex features and supports a variety of abrasive grains and lubricants. This flexible model will accommodate user-defined polishing parameters and multiple load ports, which are ideal for high-throughput applications. DFG8560 utilizes advanced grinding and polishing motions, such as controlled oscillation, combined with a ceramic grinding/polishing wheel, to achieve high-quality finishes while controlling material removal rates. This efficient combination of motions allows users to achieve precise results with minimal defect rates. DISCO DFG 8560 supports various polishing methods, including low- and high-pressure techniques. One- and two-step polishing processes are also available for specific applications and process capabilities. Furthermore, the equipment features automatic grinding/polishing depth control and the ability to read and control the position of the grinding/polishing disc. DISCO DFG8560 also features a fully automated substrate handling system. This intelligent unit allows users to transfer substrates to and from various load ports at the touch of a button, allowing for high-throughput wafer processing. In addition, the machine is compatible with a wide range of robot systems, allowing for integration into user-defined production lines. Finally, DFG 8560 utilizes a robust data collection machine that is capable of providing process-related data such as wafer position, material removal rate, pressure and polishing rate. This powerful tool not only enables users to analyze asset performance, but also supports traceability and quality control. DFG8560 is a highly efficient and reliable wafer grinding, lapping & polishing model that meets the demanding requirements of the semiconductor, MEMS, nanotechnology and microelectronics industries. Its advanced core technology and user-friendly design allow for precise results while offering users the ability to tailor the equipment to their exact needs.