Used DISCO DFG 8560 #9218113 for sale

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ID: 9218113
Wafer Size: 8"-12"
Vintage: 2004
Wafer grinder, 8"-12" 2004 vintage.
DISCO DFG 8560 Wafer Grinding, Lapping & Polishing equipment is a multi-functional tool designed to deliver superior performance in precision micromachining. This system utilizes a newly developed lapping and polishing process to provide superior surface planarity and surface finish. The unit is an ideal solution for wafer-level thinning and polishing operations in semiconductor and flat panel display applications. DISCO DFG8560 features a state-of-the-art CNC servo control machine. This allows for flexibility in the establishment of the lapping speed and other parameters for high precision lapping and polishing. The tool is designed to simultaneously grind and lap any two sides of the wafer in a manner that ensures the equal processing of both surfaces. It is also capable of providing a uniform, gently curved edge radius. DFG 8560 comes equipped with a robust motor control asset that maintains an accurate and stable grinding and lapping speed. This ensures greater accuracy in the grinding and lapping process. The model is capable of grinding and lapping both sides of a wafer in a single pass, which is then followed by a separate polishing pass. It is also capable of automatically adjusting the polishing pressure and amount of polishing material used based on the properties of the wafer material. DFG8560 employs a specialized lapping material to deliver high precision grinding and Lapping. The equipment utilizes a wide range of abrasives including diamond, alumina, and silicon carbide, and abrasive belts for both lapping and polishing. The abrasive belts are adjustable to produce optimal lapping and polishing results. The integrated wafer and chuck clamping system is designed for easy and consistent loading of wafers up to 6" in diameter. DISCO DGF 8560 also features an integrated cleaning unit for superior surface cleanliness. The cleaning step is performed after grinding and lapping and is said to remove particles and dust from the wafer surfaces prior to polishing. Additionally, the machine features a programmable automatic air blows for safe and highly efficient cleaning. The air blows can also be used for pre and post cleaning of the grinding and polishing tools. Finally, DISCO DFG 8560 is equipped with safety features, such as an emergency power-off button and a safety cover in order to protect both the operators and the machine from potential dangers. The tool is designed for integration into production line systems, and its user-friendly operation allows for easy setup and operation. The asset's durability and reliability provide for a consistent output and superior results.
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