Used DISCO DFG 8560 #9237193 for sale

DISCO DFG 8560 is a precision wafer grinding, lapping and polishing equipment from DISCO Corporation. It provides high accuracy, productivity and superior grind quality for processing a variety of materials like silicon, quartz and sapphire substrates. DISCO DFG8560 is equipped with a multi-axis spindle that¹s capable of moving both the wafer and the grinding tool simultaneously, allowing for precision grinding while still maintaining tight control of the grinding process. Furthermore, its grinding, lapping and polishing functions are sub-divided into two stages to reduce processing times and improve overall process reliability. The precision and repeatability of the system is further enhanced through its class-leading automation capabilities. It integrates auto alignment, depth accuracies, and feedback control to provide precise grinding and polishing coordinates. Additionally, DFG 8560 provides advanced silent lapping and polishing capabilities for the generation of ultra-high precision surfaces. Its Programmable Logic Control (PLC) interface is designed to finely configure machining parameters, allowing users to fine-tune machine precision and productivity. DFG8560 also incorporates safety and environmental protection features. It is fitted with a real-time monitoring unit that automatically scans the wafer for any anomalies detected during grinding and polishing, and can detect any abnormal temperature or vibration levels, ensuring the safety of both the machine and personnel. It also uses a type of electrode water management machine to efficiently capture and control the environmental footprint of its operations. In conclusion, DISCO DFG 8560 is an advanced wafer grinding, lapping and polishing tool that provides precise control over the grinding and polishing process. It is equipped with class-leading automation, safety, and environmental protection features, making it an ideal choice for the most demanding grinding job requirements.