Used DISCO DFG 8560 #9247766 for sale

DISCO DFG 8560 is an advanced wafer grinding, lapping & polishing equipment used for device fabrication applications. This system is able to grind, lap, and polish a variety of material surfaces such as gallium nitride (GaN), silicon (Si) and silicon dioxide (SiO2). The unit combines features such as a double-sided lapping table, multi-station grinding, and a variable speed polishing spindle to facilitate fast and precise grinding, lapping, and polishing process. DISCO DFG8560 machine comes with a variety of features that enable efficient and precise processing of wafers. Its double-sided lapping table is equipped with two lap plates for simultaneous grinding and lapping process. The table is adjustable in both horizontal and vertical direction so that the distance between the two lap plates can be secured and maintained, ensuring wafer smoothness and precision. Additionally, the lapping plates are hollowed and perforated which creates a uniform environment that uniformly distributes the abrasive suspension during the grinding and lapping process. The tool also includes a multi-station grinding wheel head. This feature enables concurrent grinding on both the inner and outer edges of the wafer. When combined with the lapping table, this feature helps to achieve high smoothness of the wafer surface, which is necessary for device fabrication. The grinding wheel head is also equipped with a variable speed spindle that allows setting the spindle to the optimal speed for achieving the required wafer surface finish. DFG 8560 also includes an efficiency polishing head with a multi-point polishing arm. This feature effectively removes the dishing-related defects that may occur during the processing of the wafer. The polishing arm works based on a custom-programmed motion that adjusts its path automatically to remove any residual surface defects while ensuring an optimal finish of the wafer. The feature-rich DFG8560 also employs an advanced software asset that monitors the grinding, lapping, and polishing process. This model is responsible for maintaining maximum efficiency while ensuring precise results of the processing cycle. The software can also generate detailed reports of the produced wafer surfaces, which can be used to improve the process and achieve better results. Overall, DISCO DFG 8560 is a powerful wafer grinding, lapping & polishing equipment that is ideal for device fabrication applications. With its advanced features, it is able to facilitate efficient and precise processing of wafers. The system combines a double-sided lapping table, a multi-station grinding wheel head, a variable speed polishing spindle, and an efficiency polishing head with a multi-point polishing arm. All of these features, combined with the advanced software unit, make DISCO DFG8560 a suitable tool for achieving the desired results quickly and accurately.