Used DISCO DFG 8560 #9247769 for sale

DISCO DFG 8560 is a high-precision automated wafer grinding, lapping and polishing equipment designed for processing a wide variety of materials. It is capable of grinding, lapping and polishing large diameter wafers up to 8" with uniform results and high precision. The system is equipped with a high-torque diamond-grinding motor, a powerful accurately adjustable grinding feed unit and a precision lapping/polishing mechanism. All three subsystems enable rapid and precise processing with consistent results, while ensuring uniform surface finish and quality. The machine has the ability to grind, lap and polish simultaneously, which reduces processing time and cost significantly. The machine is also equipped with a number of advanced functions, such as a unique 6-axis programmable workpiece chuck and a positional accuracy optical microscope for accurate positioning and visual monitoring of the wafer's progress. It also features a wide range of process parameters, including motor speeds, feed rates, lapping/polishing force and positioning accuracy. All these parameters can be programmed and adjusted to produce the desired results. The user interface is intuitive and easy-to-use, enabling operators to quickly set up the tool and monitor the process. It also provides the operator with feedback on the process status, as well as the grinding, lapping and polishing times. In addition, the machine is capable of producing high accuracy processes with a low noise emission and very low power consumption. Overall, DISCO DFG8560 is an ideal choice for wafer production and thin-film technologies, because of its high precision, low noise and low power consumption. It is also user friendly and programmable, which makes it suitable for automated production. With these features, it is expected to help manufacturers reduce their wafer processing costs, while improving process performance and product quality.