Used DISCO DFG 8560 #9254255 for sale

DISCO DFG 8560 is an automated, full-size wafer grinding, lapping and polishing equipment. It is designed for accomplishing a wide range of processing needs for quartz, silicon, and ceramic wafers up to 8 inches in diameter. DISCO DFG8560 provides the highest accuracy, precision, and repeatability with high-throughput productions. DFG 8560 is capable of precise wafer grinding, lapping, and polishing. It is designed with a dual-arm servo robotic wafer handling system which enables individual or multi-stage wafer loading and unloading. All motions are controlled with a high-speed servo motor and precision linear motors and slide rails for reliable and repeatable operations. The grinding head is equipped with an adjustable wheel spindle and a quick-change wheel hub for efficient grinding. The grinding wheel is capable of long grinding life and generating less debris. The lapping stage uses a sliding table unit and force feedback machine for highly precise lapping operations. The lap plate is designed with a quick release mechanism for rapid disc changeover and easy maintenance. The precision rotary table is driven by a brushless servo motor and is able to deliver more accuracy and stability with a wide range of rotational speed and amount of force. The polishing tool features a dynamic auto-pressure asset for reducing load pressure variation and delivers more consistency for polishing results. The polishing table is driven by a brushless servo motor and has a quick-change mechanism for quick and easy pad changeover. The model also offers the ability to adjust pitch, acceleration, and velocity for rapid and highly-precise polishing results. The sophisticated PLC controller of DFG8560 is equipped with a high performance CPU and comprehensive software packages. Highly flexible automation capabilities are provided with the programmable logic controller, allowing user to control and monitor the processing conditions from one central location. DISCO DFG 8560 is designed for use in the production of semiconductor wafers, compound wafers, MEMS wafers, Ceramic substrates, and other related industries. With its robust construction and outstanding polishing results, DISCO DFG8560 is the ideal equipment for the demanding production needs of industry.