Used DISCO DFG 8560 #9284122 for sale

DISCO DFG 8560 is a wafer grinding, lapping, and polishing equipment designed to provide superior precision machining for the most exacting processing needs. It caters to a wide variety of surface finishing requirements, allowing for maximum flexibility and accuracy. DISCO DFG8560 features a large capacity work area of up to 10 inches in diameter for wafer grinding, lapping, and polishing up to 190mm in diameter. The system supports a wide range of grinding, lapping, and polishing media, including various abrasive grits, diamond, and CBN. DFG 8560 is capable of precision machining with high speed, sub-micron accuracy, and excellent surface finish. The precision machining unit is equipped with a robust four-motor drive machine for grinding, lapping, and polishing operations. This allows for fast and accurate machining of complex and intricate geometries. The tool utilizes a state-of-the-art digital control asset to manage all the process parameters. It is equipped with a dynamic process monitor to optimize grinding, lapping, and polishing processes. The monitor helps the operator adjust and maintain the machine's speed and pressure levels in order to produce consistent, repeatable machining results. DFG8560 has a low radial profile that helps reduce machine vibration and improves process stability. It is also powerful enough to accommodate large wafers or other parts in various shapes and sizes. DISCO DFG 8560 is a durable, reliable, and powerful model that is capable of producing consistent, high-quality results. It is user-friendly, and its modular design allows for easy customization and upgradability, making it an ideal choice for any machining requirements.