Used DISCO DFG 8560 #9314668 for sale

DISCO DFG 8560 is an advanced wafer grinding, lapping and polishing equipment designed for integrated circuit (IC) fabrication processes. This system is highly automated and is capable of grinding, lapping and polishing large quantities of semiconductor wafers quickly and efficiently. DISCO DFG8560 features a highly efficient drive unit, rotational control, vibration dampening, and automatic thermal control. With its X-Y-Z motion control and two-axis positioning, it offers user-friendly operation and versatile wafer handling. The machine's design incorporates a horizontally and vertically adjustable O-ring seal as well as a self-loading chuck for IC wafer grinding. The drive tool and its motion control allow for high speed grinding, lapping, and polishing, without vibration. The automatic thermal control prevents over heating of the chuck and the wafers during the process. It also helps control the force and speed of grinding. DFG 8560 has multiple optional features, such as a vacuum chuck, a collision prevention asset, a laser marker, and a rotational tachometer. The vacuum chuck allows for more wafers to be lapped at once and can be used for both wet and dry processes. The collision prevention model can be set up to keep wafers from grinding too hard against each other, as well as to prevent wafer damage due to accidental contact. The laser marker is used to mark each wafer with individual ID numbers and is fully programmable. The rotational tachometer provides precise feedback on the rotational speed of the grinding plate. DFG8560 utilizes advanced software to monitor and control the entire grinding, lapping, and polishing process. The software recycles the used fluids and slurry and can be configured to control the temperature and pressure of each process. This equipment is compatible with several types of grinding plates and polishing pads, allowing the user to choose the correct one for their application. DISCO DFG 8560 offers a high level of reliability and robustness, with its rugged construction and pre-tightened motor screws. A wide variety of wafers can be processed on the system, including gallium arsenide (GaAs), indium phosphide (InP), and Silicon-on-Insulator (SOI). With its multiple features and versatile operation, DISCO DFG8560 is an ideal choice for continuous and repetitive wafer grinding, lapping, and polishing.