Used DISCO DFG 8560 #9384708 for sale

DISCO DFG 8560 is a wafer grinding, lapping, and polishing equipment designed for efficient processing of 3" to 200mm diameter wafers. This is ideal for IC manufacturers and advanced wafer research and product development laboratories. Its key features include a fully automated plate-to-wafer handling system, oscillation grinding, lapping, and polishing, as well as final off-line wafer inspection. The machine is equipped with a double-sided wafer handling unit for loading and unloading wafers from the front of the machine. The plate-to-wafer handling machine includes eight automated loader/unloader trays that can be operated independently. The wafers are then mounted on to vacuum chucks for grinding, lapping or polishing. The grinding process is carried out by two plate-mated grinding wheels that oscillate in unison to provide a constant grinding force. The wheels are then suspended on a spring-loaded, double-link mechanism that automatically adjusts the oscillation stroke length and grinding force. For polishing, multiple wafer substrates can be mounted onto four lapping plates that are supported by a bridge. The plates feature top-mounted polishing wheels that can be adjusted for different wafer sizes. DISCO DFG8560 also features double-sided spindle wafer holders, enabling back-to-back grinding and lapping of both sides of a wafer in a single operation. The wafer holders features vacuum chucks that latch onto the substrates for secure handling. DFG 8560 also has a programmable wafer orientation tool for various operations. The wafer orientation can be changed in 12 different directions and can also be used for edge grinding or off-angle lapping. The machine features a two-axis variable-speed control asset (X-Y) for adjusting both the grinding and lapping speeds. This model allows for precise control of the speed, direction, and angle of the grinding and lapping tasks. The equipment is constructed from stainless steel for superior durability and performance. The machine also features a fully automated wafer cleaning and dry-cleaning cycle, which can be programmed to automatically purify, dry, and clean the wafers after the grinding, lapping, and polishing processes. The cleaning cycle also includes an up-right sprayer and water jet, enabling the removal of tightly adhering particles from the wafer's surface. The machine additionally features a dual-level, surface-inspection system for ensuring superior, consistent wafer quality. The unit includes two separate, high-resolution cameras that can digitally inspect both the front and back side of the wafers. In conclusion, DFG8560 is a professional-grade, wafer grinding, lapping, and polishing machine that is ideal for IC manufacturers and advanced wafer research and product development laboratories. Its automated plate-to-wafer handling tool, oscillation grinding, lapping, and polishing capabilities, and two-axis speed control asset make it the perfect solution for quickly and efficiently producing perfect wafers. The dual-level surface-inspection and automated cleaning and dry-cleaning cycles ensure superior wafer quality.