Used DISCO DFG 860 #9067728 for sale

DISCO DFG 860 is a wafer grinding, lapping and polishing equipment that is designed to provide high performance and reliable wafer processing. The system is capable of high-speed grinding, lapping and polishing of various semiconductor substrates including quartz, GaAs, and SiC. The wafer grinders are equipped with 8" diameter steel platters that are able to push the substrate material to the desired thickness and planarity in one pass. The unit also features a configurable control panel with graphical user interface, and has the ability to measure and monitor the material grinding speed and the polishing time. This ensures that the grinding and polishing operations are done within acceptable timeframes. DISCO DFG860 is also equipped with an automatic recirculation back-flush machine which helps prevent the build-up of abrasive particles in the grinders and platters. This tool also allows for continuous operation with no need for maintenance or shutdown. DFG 860 also has advanced automated grit loading systems that allow for repeatable and precise control of the grinding and polishing process. The asset also includes automated safety controls such as a pressure sensitive foot switch and a fail-safe shut-off feature. This ensures that the wafers are always protected from being over-grinded or over-polished. The model also features optional accessories such as a flux attachment, an elevator table, and a vacuum equipment to remove grinding dust and debris. The flux attachment allows for efficient adhesion of the lapping compound to the wafers and for improved wafer grinding performance. DFG860 is a reliable and high-performance system for wafer grinding, lapping and polishing. Its unique design and features make it the ideal unit for any semiconductor fabrication facility.