Used DISCO DFG 860 #9269010 for sale

DISCO DFG 860 is a full-fledged wafer grinding, lapping & polishing equipment designed by DISCO Hi-Tec, Japan. The system offers both grinding and polishing operations, while incorporating several advanced features to improve the production performance. The unit consists of a CCD vision-controlled diamond grinding head that is able to perform grinding, lapping and polishing operations on wide variety of semiconductors, made up of materials such as silicon oxide, silicon nitride, polymer and sapphire. The CCD vision-controlled operation provides accurate positioning and suitable grinding/polishing paths. The machine allows operation in two modes: scanning mode and single point mode. In scanning mode, the tool performs grinding operations on the wafer in epoxy, by following pre-defined contours. The adjustable feed rate ensures aggressive grinding of materials with different shapes and sizes. Whereas, in single point mode, the asset is able to perform both iron lapping and soft lapping, using a combination of tool and wheel modes to perform rough and fine lapping. The precision clamping model further provides superior surface finish in both single point and scanning modes. The equipment also complies with all safety norms and is ETL-certified. It is water- and dust-proof, with a motor-driven pump system that provides lubrication and cooling of the abrasive material. The ergonomic design ensures comfortable operation with minimal fatigue. The unit is equipped with a high-performance diamond grinding wheel, which is capable of achieving superior surface finishes, even on the hardest of materials. Additionally, it can also be used to grind and polish larger lengths of wafer substrates. Overall, DISCO DFG860 wafer grinding, lapping & polishing machine is a reliable and efficient tool for a variety of grinding, lapping and polishing operations. It offers superior performance, high precision, and is well-suited for both research and production applications.