Used DISCO DFG 860 #9397650 for sale

DISCO DFG 860 is an efficient, precise and automated wafer grinding, lapping and polishing equipment, designed to optimize the wafer fabrication process. It is suitable for both double-skin and single-skin wafers with a diameter up to 8 inches (200 mm). The fully automated system features a number of features for efficient operation. The wafers are loaded and unloaded automatically, and the unit operates with high speed and accuracy. The grinding, polishing and lapping processes are all monitored, so any irregularities can be corrected and the entire process can be kept within specifications. The grinding part of the machine is equipped with an accurate and durable diamond grinding wheel, enabling very precise surfacing of both single- and double-skin wafers. The grindstones move in both rotational and translational directions, allowing for precise and uniform results. In addition, the grinding wheel is enclosed in a dust-free case to protect the wafers from external contamination. The lapping process is also automated with a precise linear motion and a scratch-resistant lapping material. A high-speed rotating lapping platter is used to automatically achieve precise surfaces with a continuous and uniform finish. The polishing process is done using a specially designed polishing pad, allowing for precise and uniform results. The polishing process is controlled by a computerized measurement tool, so the accuracy and repeatability of the surfaces can be tightly monitored and maintained. DISCO DFG860 is highly customisable and can be tailored to meet a wide range of applications and processes, making it an ideal solution for the fabrication of high-quality single- and double-skin wafers. With its automated features, accurate and precise results, and durable construction, this wafer grinding, lapping & polishing asset is a great addition for any wafer fabrication facility.