Used DISCO DFG 8760 #293616886 for sale

DISCO CorporationDISCO DFG 8760 is a dual-spin-disk grinding, lapping, and polishing equipment, used to achieve high levels of surface flatness and parallelism on large-diameter wafers. The system is ideal for use in the semiconductor wafer, flat-panel, and disk drive industries, providing precision levels of machining and polishing on large wafer substrates. DFG 8760 consists of two technologies: spin-disk grinding and polishing. The spin-disk grinding technology uses an abrasive disk and a rotating workpiece to generate a grinding surface. The polishing technology combines both chemical and mechanical action to grind, lap and polish the substrate surface. The main feature of DISCO DFG 8760 is its dual-spin-disk unit, which allows for easier wafer handling and faster process times. The machine is configured with two spin-disks, each installed in a separate chamber, enabling two different processes to be carried out at the same time. The dual-spin-disk manner reduces process time and optimizes production efficiency. DFG 8760 also features a single-point force controller, for simultaneous application of a consistent pressure on both surfaces of the wafer. This feature ensures a uniform and repeatable surface finish, as well as accurate grinding across the entire wafer. The unique design of DISCO DFG 8760 offers various advantages over other systems, such as the ability to perform a wide range of machining operations, including grinding, lapping, and polishing, in one tool. It also features an automated loading/unloading asset to enhance process speed and accuracy, as well as a manual adjustment function to change the pressure of machining as needed. In addition, DISCO Corporation provides a wide range of grinding, lapping, and polishing abrasives to ensure DFG 8760 can meet the specific needs of any application. All of the abrasives are designed to provide an optimal surface finish and superior performance. DISCO DFG 8760 is a powerful, precise, and reliable machine designed to meet the needs of the semiconductor, flat-panel, and disk drive industries. Its state-of-the-art features make it a highly efficient model for achieving optimal surface flatness and parallelism on large wafer substrates.