Used DISCO DFG 8760 #293812125 for sale

DISCO DFG 8760 is a next-generation, multi-purpose wafer grinding, lapping and polishing equipment. It is EMSoft's flagship model and the most advanced and comprehensive wafer processing system available for all major wafer applications, such as semiconductors, MEMS, and LCDs. This unit features a fully-automatic, ultra-precise, electronically-controlled grinding, lapping, and polishing platform. It is designed to provide absolute flexibility in the processing of wafers from 74 to 76mm in diameter, with full recovery of roundness and flatness. Its integrated sensors and powerful vision systems provide easy, real-time control of the process. DFG 8760 machine is composed of essential modules such as an Indexer, Handler, and Monitor. The Indexer is a programmable-shaft-driven, multiplenested, multi-stage alignment unit that can automatically position up to three different grinding, lapping and polishing heads for processing. The Handler gently moves single wafers from station to station and assures micro-positioning accuracy. The Monitor performs real-time sensor data acquisition for controlling the parameters such as speed, position, and pressure. In addition, state-of-the-art software makes use of intelligent process algorithms to control the tool, monitor its performance, and adjust its settings for optimal results. Also, it uses an easy-to-use pointing and clicking graphical user interface (GUI) for easy operation. The intelligent programming algorithm and GUI allow for automated and accurate process control, removing the need for lengthy set-up times or manual adjustments. Furthermore, DISCO DFG 8760 has a wide range of optional equipment including an ultra-precise diamond turning tool for ultra-flat wafers, an adjustable motion base for fine tuning the eccentricity and a diamond encrustation tool for anti-reflection and scratch resistant coatings. In conclusion, DFG 8760 Wafer Grinding, Lapping and Polishing asset is an efficient and highly precise wafer-processing model designed for a broad range of wafer applications. Thanks to its flexible modular design, advanced control algorithms, and real-time monitoring capabilities, this equipment can provide superior wafer surface quality and significantly reduce time-to-market.