Used DISCO DFG 8761 #293754780 for sale

DISCO DFG 8761 is a wafer grinding equipment that combines the power of precision grinding and lapping to achieve ultimate accuracy. This system provides three-dimensional grinding, lapping and polishing capabilities, making it one of the most powerful and versatile tools available in the market today. The unit is designed to enable fast, accurate slicing and automated grinding on all types of substrates including glass and composite materials. Its rigid design and robust construction provides outstanding stability and accuracy to guarantee perfect surface quality on every product. The wafer grinding machine consists of a milling head, a multi-axis spindle rotation mechanism and a stage. The milling head is a highly accurate device that can handle a range of substrates up to 500mm in diameter. It offers a cutting range of 0.4 to 10mm in a single pass, enabling the grinding of very thin substrates with a high degree of accuracy. The spindle rotation mechanism allows for high-precision grinding to ensure the best surface quality. The tool also features a two-axis rotary table with a tilt range of 20° to 160° to ensure precision alignment of the sample onto the disc lapping. The lapping is enabled by a polishing head with an adjustable speed of up to 6 m/s and a standard force of 2.5 N. The polishing head can be equipped with a wide variety of consumables, including abrasive discs, diamond pads, and dicing blades. DFG 8761 also provides advanced monitoring and control capabilities, allowing the user to program grinding parameters, monitor the process, and log results. The asset is capable of storing up to 128 sets of data to facilitate repeatable, reliable operation. Furthermore, a video monitor and camera can be connected to the model to enable easy observation of grinding and polishing operations. In summary, DISCO DFG 8761 is an advanced and highly versatile lapping and grinding equipment that enables fast, accurate cutting and automatic grinding on a range of substrates. Its high precision and excellent stability guarantee perfect surface quality of substrates with a cutting range of 0.4 to 10mm in a single pass. The system also provides advanced monitoring and control capabilities, allowing the user to program grinding parameters, monitor the process, and log results.