Used DISCO DFM 2800 / DGP 8761 #9277917 for sale

DISCO DFM 2800 / DGP 8761 is a wafer grinding, lapping, and polishing equipment that with a single integrated platform, enables the fabrication of precision wafers. This system offers unprecedented high levels of performance, accuracy, and repeatability for grinding, lapping and polishing on wafers. The unit employs a three stage grinding/lapping process to produce highly accurate surfaces suitable for electrical, optical, and micro-mechanical components. The first stage of the process is a grinding wheel which is coated with an abrasive material. This is followed by a lapping step which employs a rotating platen to lap the wafer against a second, finer abrasive in order to remove any burrs or surface irregularities. The final stage utilizes a polishing block that has been specially designed to produce a smooth, shiny finish. The DFM 2800 has a built-in automatic grinding and lapping process that allows operators to quickly and easily set the process parameters and monitor the production process. The machine also includes a vision tool which can detect inaccuracies or defects in the wafer. The accuracy and repeatability of the asset is further improved by its ability to accurately monitor the spindle's speed, movement, and power usage. The DGP 8761 contains several proprietary technologies that further improve the accuracy and repeatability of the process. It utilizes a proprietary grinding wheel design to minimize abrasion and provide improved grit removal while also improving process accuracy. The model also contains a unique pitch-controlled polishing wheel design which helps to produce highly precise and consistent surfaces and edges. DFM 2800 / DGP 8761 is an ideal solution for the fabrication of wafer substrates that require extreme precision and accuracy. By enabling higher levels of quality control and repeatability, this equipment is a key to ensuring consistent and reliable results from wafer production.