Used DISCO DFP 8140 #293622677 for sale

DISCO DFP 8140 is a precision wafer grinding, lapping and polishing equipment that can be used to process a wide range of semiconductor substrates. It is designed to provide the highest degree of accuracy in grinding, lapping, and polishing of semiconductor substrates in order to achieve the most consistent surface quality. DISCO DFP8140 is a fully automated system that can grind, lap and polish multiple wafers simultaneously. Utilizing an advanced wafer grinding unit and a highly reliable lapping/polishing unit, this machine is capable of processing substrates with outstanding surface integrity and minimal scratches. The wafers are loaded and unloaded from the tool in an easy-to-use cassette-to-cassette environment. The asset is designed to work with a wide range of wafer substrates, including silicon, glass and quartz, and can be used with various kinds of lapping films. The model also provides thorough cleaning and drying of each wafer before and after the grinding, lapping and polishing process to ensure optimum results. The equipment features an automated lapping and polishing process, which uses a unique sliding motion to apply and remove lapping compound to the surface of the wafer, while a robotic arm guides the lapping head to lap the surface of the wafer in a uniform manner. It is engineered with a robust and highly accurate auto-calibration feature, which allows the system to continually adjust grinding, lapping and polishing conditions for optimal results. In addition, the unit also features a highly efficient replacement part-management machine, which eliminates the need for manual labor by automatically dispatching replacement parts to replace worn parts. Its extremely user-friendly interface provides complete control over the entire process, from replacing parts to controlling parameters. The tool is also designed to generate detailed process-log information that can be used for future process development and process optimization. Through its advanced technological features, DFP 8140 is capable of providing fast, repeatable and reliable grinding, lapping and polishing performance for a variety of wafer substrates. It is an excellent choice for applications that require the highest level of precision, accuracy and surface quality.