Used DISCO DFP 8140 #293759751 for sale

DISCO DFP 8140 is a wafer grinding, lapping and polishing equipment that is used to finish the surfaces of ultra-thin semiconductor wafers. This system can process up to 300 mm diameter wafers and is suitable for a wide range of applications. DISCO DFP8140 features an integrated grinder that can quickly remove surface material with minimal damage to the underlying material. The integrated grinder utilizes two separate diamond grinding wheels to provide a highly efficient, controllable and adjustable grinding process. The integrated lapper feature of the unit enables the user to fine-tune the surface finish of the wafer with a high degree of precision and accuracy. This feature allows for lapping rates that are up to 5 times faster than mechanical lapping processes. The integrated particle separator allows the user to remove large (> 1 μm) particles that could potentially damage the surface of the wafer during grinding and lapping. Additionally, the separator also serves to reject smaller particles that could damage the surface during polishing. The machine also includes a polishing station that utilizes a planetary polisher to provide a smooth flat surface finish. This feature helps to reduce surface roughness, scratches, and defects. DFP 8140 is a versatile tool that can be used in a variety of processes. The asset can be used for backside polishing of ultra-thin wafers that are used in MEMS and NEMS devices. Additionally, it can be used for backside grinding of GaN material used in LED lighting applications. It can also be used for resist wafer polishing and other grinding & polishing processes. DFP8140 has a user-friendly HMI interface that provides a straightforward and intuitive user experience. It also features a variety of data logging and monitoring functions that allow the user to monitor and record the process parameters and performance. This helps to ensure that the process is running at its optimal level. Additionally, the model can help to reduce wastage and lower operational costs by optimizing the quantity of consumables used and by reducing process times. Overall, DISCO DFP 8140 is an advanced wafer grinding, lapping and polishing equipment that is highly efficient, precise, and reliable. It is suitable for processing a wide range of materials and applications and can help to improve the quality and efficiency of the process.