Used DISCO DFP 8140 #293820676 for sale

DISCO DFP 8140 is a patented, next generation wafer grinding, lapping and polishing equipment from DISCO Corporation. Using advanced wafer fabrication technologies, DISCO DFP8140 offers superior wafer accuracy and superior control for high precision finishing processes for a wide range of metallic, non-metallic and hard materials with minimal material wastage. DFP 8140 brings a series of innovative design and technology upgrades from the award-winning DFP 8100 series, creating a fully automated wafer grinding system that is easy to use and maintain even in conditions of extreme temperature and vibration. DFP8140 features a fully enclosed vacuum chamber, or isolator, to reduce atmospheric disturbances and cross-contamination. The unit is equipped with a high powered grinding spindle and integrated vision machine, equipped with active cooling. The spindle is driven by a brushless DC motor and its rotor speed is adjustable up to 60,000 rpm. In the grinding stage, a specialized wafer carrier is used to rotate the wafer. A diamond disk or belt is used to remove the outer layer of material while a diamond film is inserted to condition the surface of the wafer. In the lapping stage, two sets of lapping machines are used to further polish the wafer surface, one for flat lapping and one for bevel lapping. The flat lapping machine uses a diamond abrasive and lubricant and the bevel lapping machine uses a low-viscosity, micro-emulsion-based lubricant. Both lapping machines are equipped with an air-bearing spindle, to ensure wafer rotation is even and vibration free, and a cooling tool to maintain a stable temperature during the process. In the polishing stage, the wafer is further polished using both mechanical and chemical means. During the mechanical step, a diamond abrasive is used to the reduce the surface roughness. In the chemical step, a polishing agent is applied to the surface, to achieve a smooth and uniform finish. DISCO DFP 8140's advanced automation capabilities provide users with improved accuracy and control for achieving high precision finishes. The asset is also equipped with a unique set of hard-stop feature that allows for extra-fine tuning and precision control of the lapping and polishing results. Overall, DISCO DFP8140 offers a reliable, robust and easy to use wafer grinding, lapping and polishing model designed to meet the demands of high precision wafer grinding and polishing processes. Its advanced features and automation capabilities ensure high accuracy and repeatable results.