Used DISCO DFP 8140 #9208200 for sale

DISCO DFP 8140 is a high-precision, fully automated grinding, lapping and polishing equipment for semiconductor wafers. DISCO DFP8140 utilizes advanced micro-abrasive technology to perform complex processing operations with high levels of efficiency and accuracy. The system's integrated software unit controls machine options, machine performance, and provides detailed process and data information. The machine's wafer holder is designed to securely hold up to 400 wafers of up to 6 inches in diameter. Wafers can be loaded and unloaded quickly and accurately with the use of vacuum suction and precise registration plates. The tool's advanced grinding and polishing technology produces uniform shapes with precise alignment and excellent surface finishing. The wafer holder rotates while two slurry heads simultaneously polish the wafers. The polishing heads can be adjusted in height and angle to ensure maximum grinding efficiency. DFP 8140 is also equipped with a wide range of options, including different types of grinding slurries, polishing heads, and grinding and lapping tools. The asset also includes a variety of monitoring and testing systems, such as a stress meter, contact angle meter, and visual inspection. This allows users to verify the accuracy of the grinding and polishing processes. DFP8140 is designed for use in research and development applications as well as industrial production environments. The model is kept in a clean environment to prevent unwanted dust and particles and for maximum productivity. The equipment ensures safety by using safety interlock switches, emergency stop buttons and a dust evacuation system. DISCO DFP 8140 is an effective and reliable machine for grinding and polishing precision components. It offers repeatable accuracy and reliability and easy maintenance. It provides the highest quality results with a wide range of options and monitoring features to ensure that wafer grinding and lapping processes are accurate and efficient.