Used DISCO DFP 8140 #9217492 for sale

DISCO DFP 8140 is a wafer grinding, lapping, and polishing equipment used to achieve perfectly flat and smooth surfaces on a wide variety of wafers and substrates. The system is based on DISCO proven technologies such as its patented Variable Speed Hydroplaning technology and its paddle-along lapping plates. The modular design of the unit allows for a variety of configurations depending on customer needs and specifications. The machine utilizes both pneumatic and manual wheel carriers for loading and unloading of wafer carriers, and is equipped with both double-side as well as single-side grinding processes. The tool is built for the highest level of accuracy and precision in the grinding and polishing process, employing a variety of cutting, grinding, and finishing tools as well as polish pads and polishing compounds. The patented Variable Speed Hydroplaning technology utilizes a fluid to control the speed of the grinding and polishing operations. This fluid is highly viscous and can be accurately controlled regardless of the type of grinding media used. This negates the need for a highly engineered process for achieving ultra-smooth surfaces and results in decreased maintenance costs and improved cost savings. The asset also features a multi-zone process allowing for flexibility and greater control over lapping and polishing operations. DISCO DFP8140 also features a highly advanced computer control model that can be programmed for a variety of processes. This ensures accurate grinding and polishing of substrates as well as consistent results. The on-board diagnostic equipment allows for troubleshooting and maintenance as well as easy monitoring of the various processes. DFP 8140 also features an air-conditioned environment for the entire system. This helps to optimize the performance of the grinding and polishing operations as well as provide a safe working environment for the operators. The unit also comes with mauve chamber for safety as well as dust control. Overall, DFP8140 is an excellent general-purpose professional level grinding, lapping, and polishing machine. It features a versatile modular design that allows for a variety of configurations and processes, highly advanced computer control tool, and excellent environmental control features. The asset is perfect for achieving ultra-smooth surfaces on wafers and substrates with increased efficiency and cost savings.