Used DISCO DFP 8140 #9232792 for sale

DISCO DFP 8140 is a wafer grinding, lapping and polishing equipment that helps produce high quality polished wafer surfaces to meet today's emerging semiconductor device requirements. It is particularly suited for production of silicon wafers, silicon-on-insulator (SOI) wafers and other similar hard materials. DISCO DFP8140 consists of a rotary lapping table, a grinding unit, a polishing unit, an optional pilot unit and an abrasive supply system. The rotary lapping table can be used to achieve various target geometries including planar, spherical, regular-profile, and elliptical surfaces. The grinding unit consists of abrasive grinding wheels of various sizes and materials. This unit is used to grind the wafer surface to its desired roughness. The polishing unit consists of diamond disks and polishing liquids. This unit is used to polish the wafer surface to its desired smoothness. The optional pilot unit is used for prototyping and process development purposes. In addition to the core components, DFP 8140 also comes with a wafer edge profiling unit and a three-axis robotic wafer-handling machine. The wafer edge profiling tool is used to profile the edge of the wafer to its desired profile. The three-axis robotic wafer-handling asset is used to move and position the wafer to the respective processing units. DFP8140 also includes a control console to monitor the process and data from the various components of the machine. This console helps to adjust the lapping table parameters, spin direction, spin speed, feed rate, grinding wheels, polishing disks, and to monitor and adjust the load. DISCO DFP 8140 is a highly reliable, versatile, and cost-effective wafer lapping and polishing model. It is used to achieve the highest quality polished wafer surfaces and can be used for almost any application requiring the highest quality results. This equipment is well suited for production of silicon wafers, SOI wafers, and other hard materials, for use in semiconductor device manufacturing and other related processes.