Used DISCO DFP 8140 #9252053 for sale

DISCO DFP 8140 is a wafer grinding, lapping and polishing equipment that is designed to be highly flexible, enabling users to configure automated production processes for a wide range of applications. This system is equipped with a wafer carrier and four spindles that are used to spin the wafer discs during grinding. Each spindle is driven by a separate motor, allowing the unit to be controlled independently. In addition, each spindle has an optical overhead camera which can be used to monitor the progress and maintain the highest quality standards during grinding. DISCO DFP8140 also features a wide selection of tools for grinding and polishing wafers. These include both fixed grinding wheels as well as interchangeable polishing pads, which can be tailored according to the particular requirements of the application. This machine is capable of grinding and polishing a variety of materials, including silicon, alumina, and silicon carbide. It also features an innovative in-process cleaning tool, which can be programmed to clean the wafers as they are being processed. The asset also accommodates a range of substrates, allowing for different types of processing, including single or multiple-sided grinding. It is also capable of handling a range of thicknesses, ensuring consistent and accurate grinding and polishing. The user can also choose from a selection of control options, including computer-controlled processing or manual control. DFP 8140 is equipped with a safety model, which is designed to protect the user from injury. Also, the easy-to-use control equipment provides a simple user interface, and can be operated by anyone, even without technological knowledge. This is further enhanced by an automated data logging system, which records all data related to the processing parameters as well as the wafer shapes and thicknesses. This data can be retrieved to enable process tracing and documentations to be provided. DFP8140 is a reliable and versatile unit, which is suitable for a variety of wafer grinding, lapping and polishing applications. Its robust construction and advanced programming features make it an ideal choice for high-precision processing applications.