Used DISCO DFP 8140 #9275334 for sale

DISCO DFP 8140 is a state-of-the-art wafer grinding, lapping, and polishing equipment designed to provide superior results for specific semiconductor applications. The eight-inch platform includes a CNC-controlled precision spindle that enables precise placement of the wafer on the grinding surface. This ensures a uniform and even grind. In addition, the system includes a hydrostatic lapping plate that provides a consistent pressure across the entire wafer, allowing for a controlled polishing process with exceptional results. The unit includes a full range of automated processes and features such as process monitoring, detailed logging of the grinding, lapping and polishing operations. This ensures repeatability and accuracy in addition to temperature control of each machine stage. The tool is capable of grinding and lapping both flat and curved wafers up to 8 inches in diameter, and polishing them to a smooth finish. The asset supports a variety of grinding and lapping media, and advanced abrasive particles. Additionally, the model can accurately mimic complex geometries, making it suitable for challenging applications. DISCO DFP8140 also features several safety features, such as a safety interlock that prevents activation of the equipment until the operator has installed the grinding, lapping and polishing tools to the desired settings, and shatterproof covers that protect personnel from shattering particles. The system is both environmentally friendly and energy efficient, and is equipped with high-performance filtration systems that eliminate 99.995% of airborne contaminants. Overall, DFP 8140 unit is designed to provide superior results in a wide array of semiconductor applications, with efficiency, accuracy, and safety at its core. Its advanced features and automated processes make it ideal for the most challenging applications, and enable consistent results every time.