Used DISCO DFP 8140 #9281537 for sale

DISCO DFP 8140 wafer grinding, lapping and polishing equipment is an advanced piece of microfabrication equipment capable of producing advanced flat and stepped surfaces on a wide range of substrates. The machine uses two separate grinding, lapping and polishing stages, along with a number of added features to create high quality surfaces. The system is composed of a rotary table, a tool station, a lapping/polishing plate, and a motor. The rotary table incorporates a closed-loop servo unit that allows for precise speed control, ensuring consistent results each time. The tool station, located above the table, houses the grinding, lapping and polishing tools. These tools, combined with the adjustable pressure and speed control, provide the user with the ability to produce surfaces of varying complexity The lapping/polishing plate is a modified surface plate, to which an abrasive slurry can be applied. This slurry can then be employed to lap and polish the substrates being processed to the desired finish quality. The motor of the machine is an AC servomotor, capable of up to 2000 rotations per minute, allowing for a speed accurate to within 0.01 RPM. This motor is controlled by a closed-loop tool that allows the user to monitor and adjust the speed of the machine at any point during the processing. A number of additional tools are included in the asset, allowing for increased freedom in surface processing. These include grooving tools, cleaning slurry jets, diamond compounds, polishing pads and more. In sum, DISCO DFP8140 wafer grinding, lapping and polishing model provides a comprehensive microfabrication environment for advanced flat and stepped surface production. The combination of rotary table, tool station, lapping/polishing plate and motor, along with a range of additional tools, offer the user maximum control over the surface processing tasks being performed. With a high accuracy speed control, DFP 8140 creates high quality surfaces with precise repeatability.