Used DISCO DFP 8140 #9395441 for sale

DISCO DFP 8140 wafer grinding, lapping & polishing equipment is an all-in-one automated machine for processing semiconductor wafers. It is capable of grinding, lapping and polishing of wafers up to 8 inches in size, allowing for maximum production throughput and minimal labor. The machine is equipped with a host of advanced features, such as an automated two-stage grinding process for improved accuracy and reproducibility, a high precision grinding spindle with an integrated temperature control unit, and a combination of different abrasives to enable various polishing and grinding operations. Additionally, the system features a five-axis motion control unit for precise and repeatable movements, an internal cooling machine to ensure uniform results, and a user-friendly HMI (Human-Machine Interface) for an easy setup and operation of the machine. Furthermore, the user can select different grinding parameters, such as speed, force and pressure, which can be varied according to the application requirements. The integrated CCD camera allows for automatic wafer inspection, while the built-in safety tool prevents damage to the wafers due to over-processing. DISCO DFP8140 is a powerful and reliable semi-automated solution for the processing of semiconductor wafers. It offers an excellent combination of flexibility, precision and consistency, making it ideal for those in the wafer processing industry.