Used DISCO DFS 8910 #9196093 for sale

DISCO DFS 8910 wafer grinding, lapping and polishing equipment is a comprehensive and multi-functional device that offers precision surface processing at the nanometer level. This wafer grinding, lapping and polishing system is perfectly suited for both low and high volume production and is specially designed to handle wafer demands up to 8-inch diameter. DISCO DFS8910 offers a superior mix of advanced features and functions that provides precision surface processing on different wafer types in a productivity-driven manufacture environment. It possesses a chuck stage that offers superior accuracy and repeatability in wafer grinding, lapping and polishing. The lapping/polishing stage is compatible with all standard disk holders and provides adjustable speed up to 5000 RPM, allowing for customizable grinding, lapping and polishing processes. The wafer grinding stages utilizes cutting angles from 2° to 7° in order to provide superior surface finish on the grinded wafer. DFS 8910 possesses an ergonomic design that helps in wafer handling, with a lift up front panel and side panel attached to the unit itself. This helps to ensure efficient operator access to the machine, as well as ease of use for technicians. Moreover, the tool also has optional mechanical and chemical cleaning capabilities for convenient wafer cleaning. This device is also equipped with a safety cover that prevents exposure of the operator and other personnel to the asset's hazardous laser radiation. DFS8910 offers a touch-screen panel for convenient operation. The digital control board allows for improvement of consistency and quality. What's more, the model also offers an effective vision inspection equipment that can detect defects from surface of the processed wafers, in order to maintain high quality throughout the process. Overall, DISCO DFS 8910 is able to provide highly precise grinding, lapping and polishing system in order to improve accuracy, repeatability and productivity for production environments. This unit's multi-functional capabilities, user-friendly design, and safety features make it the perfect choice for wafer grinding, lapping and polishing.