Used DISCO DFS 8910 #9270216 for sale

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ID: 9270216
Wafer Size: 8"
Vintage: 2006
Fully automatic surface planer, 8" Water cooled air spindle Axis Chuck type: Vacuum chuck Chuck table Wafer transfer / Cleaning unit: (2) Cassettes Process precision: Bump height variation within water: <2.0 µm Bump height variation within the die: <1.0 µm Bump roughness surface: <0.02 µm 2006 vintage.
DISCO DFS 8910 is a wafer grinding, lapping, and polishing equipment. It is a semi-automated system that utilizes a Programmable Logic Controller (PLC) to control the various aspects and parameters of the entire machining process, including the grinding and lapping speed, the depth of lapping, and the duration of lapping. DISCO DFS8910 is capable of grinding and polishing up to four different materials simultaneously, which includes semiconductor, insulator, and metallic materials. During the grinding process, loose abrasives are fed into a turntable hopper through a feed pipe, and the material is guided along the entire duration of the grinding process. This ensure the uniform grinding and lapping of all wafer surfaces. The operations of DFS 8910 are divided into three parts, the grinding process, the lapping process, and the polishing process. During grinding, the wafer is held between two grinding stones, and the precision grinding of the wafer's radial grain is managed in this stage. The purpose of the lapping process is to further refine the surface of the wafer, and it is accomplished by introducing a thin film of fine, loose abrasive to the wafer. The polishing process is used to ensure that the desired surface finish is achieved on the wafer. DFS8910 allows the user to discriminate the amount of grinding force used upon each wafer and control the lapping speed to achieve the desired results in the most efficient manner. Additionally, the unit includes some built-in safety features that ensure the safety of the material and personnel, such as an automatic stop mechanism that disengages the grinding process when the stones come too close together. DISCO DFS 8910 is a highly efficient and reliable machine that can be used to fine-tune the surfaces of various materials and wafers. Its PLC-controlled technology ensures the highest quality of results, and its automated functions reduce human error and user fatigue. This tool is suitable for all types of wafer fabrication and repair processes, and it promises to provide the safest and most reliable machining solutions.
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