Used DISCO DFS 8960 #293663241 for sale

DISCO DFS 8960 is a state-of-the-art wafer grinding, lapping and polishing equipment. It is designed for applications such as planarizing ultra-thin substrates, creating atomically flat materials, and for end-face grinding of the thinnest substrates. This machine can grind and polish wafers of sizes up to 300 mm, with a maximum thickness of 150 μm. DFS 8960 is constructed with an advanced motorized spindle system, which allows for precise adjustment of the grinding, lapping and polishing operations. This ensures high quality results, with increased accuracy and reduced material loss. Additionally, the motorized spindle unit helps to reduce the grinding force applied to the wafer, reducing the risk of small scratches and blemishes. DISCO DFS 8960 is equipped with a comprehensive machine of controlling and monitoring the various operations necessary in the wafer grinding and polishing process. This includes an intuitive graphical user interface (GUI) to monitor wafer position and the size and shape of grinding/lapping abrasives. It also includes a vision tool and an advanced motion control asset for precise movements of the spindle and wafer table. DFS 8960 is also outfitted with an integrated chamber model which helps to reduce chamber contamination, by minimizing the exposure of grinding materials to the environment. This helps to preserve the purity and precision of the material and target wafer during the grinding and polishing process. The integrated chamber also helps to reduce the maintenance costs associated with changing/cleaning of wet grinding and polishing materials. Finally, DISCO DFS 8960 is equipped with a powerful oil slurry filtration equipment. This system prevents oil slurry from entering the workplace, helping to ensure a safe environment while improving productivity and efficiency in the wafer grinding and polishing process. Overall, DFS 8960 is a highly advanced wafer grinding, lapping and polishing unit. It is designed for high quality, precise, and efficient grinding, lapping and polishing operations, making it an ideal choice for today's advanced applications.