Used DISCO DGP 8760 + DFM 2700 #293619746 for sale

DISCO DGP 8760 + DFM 2700 Wafer Grinding, Lapping & Polishing Equipment is an optimized solution that combines the advantages of both a flexible diamond grinding technology and a versatile single wafer lapping system. This state-of-the-art unit offers superior surface finish quality and defect-free surfaces suitable for a wide range of applications. In terms of its grinding technology, the DGP 8760 utilizes the benefits of both a potentiometric-operated feed mechanism and a micro-positioning drive machine, both of which were designed to achieve optimal grinding performance on any type of wafer. The machine is capable of achieving extremely high-precision surfaces, with a total control error of 0.001 µm and an ultra-fine roughness of 0.3 nm. This ensures that the device effectively eliminates any type of defect from the wafers throughout the grinding process. On the other hand, the DFM 2700 offers an extremely versatile single wafer lapping tool for the processing of surfaces. This machine is suitable for completing all kinds of wafer surfaces. It utilizes a multi-zoned lapping plate, which has a precisely controlled axis, in order to produce precise lapping results. The DFM 2700 also features three preset modes for lapping, which enable the user to complete operations in a fraction of the time required for manual lapping. In addition, the machine also offers a precise edge isolation feature, which ensures that delicate edges are handled with great care. For a higher level of reliability and accuracy, DISCO DGP 8760 / DFM 2700 Wafer Grinding, Lapping & Polishing Asset also includes advanced polishing technology. This includes special tailored diamond slurries and polishing pads, which provide a superior finish on the wafers. In addition, the model also incorporates several other user-friendly features, such as a high-performance filter equipment, an integrated semi-automatic lapping assistant, and a vacuum-assisted polishing operation. Overall, DGP 8760 + DFM 2700 Wafer Grinding, Lapping & Polishing System is a reliable, precise, and versatile solution that offers excellence in all areas of wafer grinding, lapping, and polishing. Its features provide superior surface finishes and defect-free wafers, making it an ideal machine for a variety of applications.